Modification of Isotropic Hardening Model and Application of Kinematic Hardening Model to Constitutive Equation for Plastic Behavior of Hydrostatic-Pressure-Dependent Polymers |
|
Yukio SANOMURA and Kunio HAYAKAWA |
143 |
Finite Element Analysis of Elastic Deformation of Cubic Polycrystalline Thin Films with q001r Fiber Texture |
|
Kazufumi SERIZAWA, Keisuke TANAKA, Hirohisa KIMACHI and Yosiaki AKINIWA |
150 |
X-Ray Fractography for (ż+Á) Dual Phase Stainless Steels Using Parameter ˘ĂP Obtained from Micromechanics |
|
Hajime HIROSE, Toshihiko SASAKI and Masumi SAKA |
157 |
Microstructural Change in SiCf/SiC Composite in High-Temperature Atmosphere |
|
Mitsutoshi OKADA and Tohru HISAMATSU |
163 |
Interfacial Behavior of Fiber/Matrix Based on of Middle Layer of Organic-Inorganic Nano Hybrid |
|
Yaqin FU, Qing-Qing NI, Ken KURASHIKI and Masaharu IWAMOTO |
169 |
Contact Strength and Probabilistic Estimation of Glass |
|
Manabu TAKAHASHI, Nagatoshi OKABE and Naohiro IZUMI |
175 |
Influence of Stress Change on the Fatigue Behavior and Fatigue Life of Aluminum Oxide-Dispersion-Strengthening Copper Alloy at Room Temperature and 350 |
|
Norio KAWAGOISHI, Hironobu NISITANI, Eiji KONDO, Atsunori SHIMAMOTO and Rieko TASHIRO |
182 |
White-Color Cu-Zn-Mn Alloys with Low Season Cracking Susceptibility |
|
Yasuharu YOSHIMURA, Kazuhiko KITA and Akihisa INOUE |
188 |
Development of In-Situ Type Biaxial Bending Testing Machine and Crack Growth Behavior Observation under Mixed-Mode on Glass |
|
Akira UENO, Hidehiro KISHIMOTO, Takahiro KIMURA and Koji ISOBE |
193 |
Effect of Mean Stress on Torsional Fatigue Behavior of a Medium Carbon Steel |
|
Xu CHENG, Isao OHKAWA and Masaaki MISUMI |
199 |
The Influence of Humidity on Fatigue Crack Propagation Properties in Spherical Graphite Cast Iron |
|
Hyoe USAMI, Yoshihiro SUGIYAMA, Naoto SHIRAKI, Masayuki FUNAMOTO and Yoshihito KIMURA |
207 |
Antifreeze-Permeation Behavior in a Small-Size Liquid Cooling System |
|
Rintaro MINAMITANI and Shinji MATSUSHITA |
213 |
Accelerated Reliability Test Method of Thermal Cycle Life for Solder Joints of Electronic Devices |
|
Yasumi UEGAI and Shuichi TANI |
218 |
Crack Initiation and Small Crack Growth Behavior of Age-Hardened Cu-6Ni-2Mn-2Sn-2Al Alloys |
|
Masahiro GOTO, Seung-Zeon HAN, Chang-Joo KIM, Takaei YAMAMOTO and Norio KAWAGOISHI |
223 |