Vol. 61 No. 9 CONTENTS
Special Issue on
Semiconductor Electronics
General Paper

Special Issue on Semiconductor Electronics (Vol.61 No.9)

Foreword

S.Fujita

749

Original Paper (Vol.61 No.9)

First-Principles Study on Crystal Structure and Material Properties of Perovskite Nonoxides ABX3(X=F,Cl,Sj

Yasutomo UETSUJI, Kazuyoshi TSUCHIYA and Eiji NAKAMACHI

750

Low Temperature Growth of ZnO Thin Films by Non-Equilibrium Atmospheric Pressure N2/O2 Plasma and the Growth Morphology of the Films

Yukinori NOSE, Takeshi YOSHIMURA, Atsushi ASHIDA, Tsuyoshi UEHARA and Norifumi FUJIMURA

756

Zinc Oxide Thin-Film Transistors on Flexible Substrates Fabricated by Room Temperature Process

Yuta KIMURA, Tomohiro HIGAKI, Toshihiko MAEMOTO and Shigehiko SASA

760

Electric Conduction of TiO2 Nanotube Field Effect Transistor Fabricated by Dielectrophoresis

Masayuki ISHII, Masahiro TERAUCHI, Takeshi YOSHIMURA, Tadachika NAKAYAMA and Norifumi FUJIMURA

766

Self-Organization and Photoluminescence Properties of Pb1-xSnxTe Nanodots Embedded in a Wide Bandgap CdTe Matrix

Kazuto KOIKE, Yuuki NAKATA, Atsushi IWAMOTO and Mitsuaki YANO

771

Solution-Based Ultrasonic Mist Deposition Method for the Formation of Transparent Conductive Thin Oxide Films and Organic Polymer Solar Cells

Takumi IKENOUE and Shizuo FUJITA

777

Structural Design of Flexible Electric Devices on Polymer Substrates and Application to Organic FET

Shigetaka KATORI, Shizuo FUJITA and Kazumi MATSUSHIGE

783


General Paper (Vol.61 No.9)

Original Paper (Vol.61 No.9)

Effects of Aging Condition and Humidity on Fatigue Properties of Maraging Steel

Norio KAWAGOISHI, Kosuke HAYASHI, Takanori NAGANO, Yuzo NAKAMURA, Michihiko MORIYAMA and Yoshikazu MAEDA

787

Mechanical Model for Shear Failure Based on Material Constitutive Model under Cyclic Loading -Deformation Evaluation of Column Base System of Steel Structures Employing Steel Fiber Reinforced Cementitious Composite-

Yuichi SATO, Yoshio KANEKO and Takuya FURUJO

795

Lecture (Vol.61 No.9)

Wood Biorefinery ‡V: Carbon Conversions of Wood Component Materials

Masashi KIJIMA

803