Synthesis of SnO2 Microcapsule Containing Cu by Colloidal Process and Its Application to Semicondutive Glass Composite
Haruhisa Shiomi, Kousuke Inada, Nobuyuki Komatsu
Abstract:SnO2 microcapsules containing Cu were synthesized by an interracial reaction method using W/O type emulsion with dispersing phases including Cu spherical particles. The microcapsules with different SnO2/Cu ratios were prepared and used as electrical conductive components of semiconductive glass composites. The effect of the SnO2/Cu ratio on the electrical properties of the glass composite was investigated by comparing with glass composites fabricated with Cu and SnO2 powders. The SnO2 microcapsule with average particle size of 2.73 mm was obtained. The wall of the microcapsule had about 0.65 mm thickness and consisted of about 15 particle layers of fine SnO2 Particles of 0.05 mm. The electrical properties of the glass composites with the SnO2 microcapsules had small dependence on the SnO2/Cu ratio. The glass composite with relatively small temperature dependence of electrical resistance was obtained because a good compensating effect between SnO2 and Cu on the electrical properties of the glass composites would appear by the use of the microcapsules. On the other hand, the glass composites using SnO2 and Cu powders had large compositional dependence of the electrical properties, and showed metallic properties at about 25vo1% Cu. Key Words:Tin oxide, Microcapsule, Interracial reaction, W/0 type emulsion, Glass composite, Electrical property