Warp Deformation Behavior with Chemical Curing Process for Viscoelastic Laminated Beam Composed of Epoxy Resin and Steel
Shozo NAKAMURACTsukasa SHINOHARA and Takaaki TANAKA
Abstract:Epoxy resin is usually used as a encapsulation of IC chips for electronic parts. Epoxy resin is transformed from liquid to solid by the chemical curing reaction, and then residual stresses and warp deformation are generated in the electronic parts. In this report, the warp deformation behavior for laminated beam caused by the chemical curing process of epoxy resin was examined from both sides of the experiment and theory, which are the thermo-viscoelastic numerical analysis based on the linear viscoelasticity theory and the Finite Element Analysis about the laminated beam consisted of epoxy resin and steel. As a result, it was clarified that the result of thermo-viscoelastic numerical analysis about warp deformation accorded with experimental values almost well, and the warp deformation behavior could be predicted by the thermo-viscoelastic numerical analysis with the precision that there was no problem in practical use. Key Words:Viscoelasticity, Warp Deformation, Finite Element Method, Numerical Analysis, Curing Reaction, Epoxy Resin