Tensile Properties of Polyamide Thin Films for Electronic Devices
Shengde ZHANG, Masaki OKA, Tadashi NAGASAWA, Kenji TERADA, Kaoru KOBAYASHI and Masao SAKANE
Abstract:This paper presents the results of tensile properties of four kinds of polyamide thin films with different contents of filler used in electronic devices. Tensile tests were performed to determine Youngfs modulus, proportional limit, yield stress, ultimate tensile strength and elongation of polyamide thin films. The Youngfs modulus of polyamide films increased with increasing the contents of filler, and the trend of the data was satisfactory simulated by the Kerner model. The polyamide film with 42% filler showed the largest proportional limit, yield stress and ultimate tensile strength. The elongation decreased with increasing the contents of filler. The most suitable filler content was around 40% from considering the coefficient of thermal expansion and mechanical properties of the films. Key Words:Polyamide, Thin film, Tensile properties, Filler, Electronic device