Technical Topics (Vol.56 No.10)

Measurement of Local Electrical Conductivity by Four-Point Probe Atomic Force Microscope Technique
Yang JU and Masumi SAKA	896

Original Paper (Vol.56 No.10)

Anomalous Elastic Softening in Superlattice Thin Films Studied by Picosecond-Laser Ultrasounds and Micromechanics Modeling
Nobutomo NAKAMURA, Hirotsugu OGI, Makoto FUJII, Takeshi YASUI, and Masahiko HIRAO	900
Effect of Micro Texture of Electroplated Copper Thin Films on Their Mechanical Properties
Kinji TAMAKAWA, Kazuhiko SAKUTANI, and Hideo MIURA	907
Evaluation of Mechanical Properties and Nano-Structure Analysis of Au-20Sn and Au-12Ge Solders
Tatsuya NISHIYAMA, Takeshi OGAWA and Hiroo SAKAMOTO	913
Influence of ICP Etching Damage on the Brittle-Fracture Strength of Single-Crystal Silicon
Satoshi IZUMI，Yusuke KUBODERA， Shinsuke SAKAI，Hiroshi MIYAJIMA，Kenji MURAKAMI and Toshihiko ISOKAWA	920
Bonding Strength Evaluation for Hermetic Seal of MEMS Package
Daisuke KATAGIRI，Yoshinori YOKOYAMA，Hiroo SAKAMOTO and Shigeru HAMADA	926
Development of Novel MEMS Soldering Technique Using Self-Propagating Exothermic Reaction in Al/Ni Multilayer Films
Hiroshi FUJITA, Takahiro NAMAZU and Shozo INOUE	932
Effects of Various Coating Materials on Magnetic Properties of Saccharide-Iron Oxide Nanoparticles
Seiichi SUGIMOTO, Kazuo YAGI and Masataka TOKUDA	938
Bending Tests for Polysilicon Microelements with a Help of In Situ SPM Imaging
Kazuto TANAKA，Akira TAKAMORI，Takehiro IMOTO，Kohji MINOSHIMA and Tsutao KATAYAMA	945
Observation of Cracks in Steels Using Synchrotron Radiation X-Ray Micro Tomography
Daiki SHIOZAWA, Yoshikazu NAKAI, Takayuki KURIMURA, Yasushi MORIKAGE, Hiroshi TANAKA, Hideki OKADO, Takuya MIYASHITA and Kentaro KAJIWARA	951